Wafer Bonding: Applications and Technology |  | Creators: Marin Alexe, Ulrich Gösele
Publisher: Springer
Category: eBooks
This item is no longer available
Format: Kindle Book
Media: Kindle Edition
Edition: 1
Pages: 499
Number Of Items: 1
Dewey Decimal Number: 621.38152
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Product Description
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
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